Main facilities

Main facilities description
Barrel plating device ・Gold plating device

・Silver plating device

・Nikel plating device

・Tin plating device

・Tin lead plating device

・Lead tin plating device

Electroless plating device ・Electroless nickel plating device
Special plating device ・Micropart use special barrel plating device

・Partial gold plating device

・Partial silver plating device

・Partial nickel plating device

・Partial tin plating device

Heat treat furnace ・Vacuum heat-treatment furnace

・Atmosphere heat-treatment furnace

・No oxidative atmosphere heat-treatment furnace

・Muffle furnace

真空熱処理炉

真空熱処理炉

PAGETOP
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